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Title:
RFモジュールの製造方法
Document Type and Number:
Japanese Patent JP5022021
Kind Code:
B2
Inventors:
洪 碩 佑
宋 寅 相
河 炳 柱
朴 海 錫
黄 俊 式
李 周 浩
Application Number:
JP2006347859A
Publication Date:
September 12, 2012
Filing Date:
December 25, 2006
Export Citation:
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Assignee:
三星電子株式会社
Samsung Electronics Co.,Ltd.
International Classes:
H01L41/09; H01L41/18; H01L41/22; H01L41/23; H01L41/311; H03H3/02; H03H9/17; H03H9/54; H03H9/70; H04B1/3822; H04B1/40
Domestic Patent References:
JP2004517741A
JP2003197863A
JP2004120524A
JP2005217348A
JP2004320784A
JP2006014296A
JP2003158467A
Foreign References:
US6271056
US20020079568
Attorney, Agent or Firm:
八田国際特許業務法人



 
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