Title:
半導体装置、ならびに外観検査方法
Document Type and Number:
Japanese Patent JP5027529
Kind Code:
B2
Abstract:
A semiconductor device having the structure, which is adopted for the highly precise visual inspection with a lower cost, is achieved. A semiconductor device is a semiconductor device having a region for forming an electric circuit, and includes seal rings provided in an interconnect layer and surrounding the region for forming an electric circuit, and a dummy metal via provided in the interconnect layer and located outside of the seal rings. In a cross section perpendicular to an elongating direction of the seal ring, the width of the dummy metal via is smaller than the width of the seal ring.
More Like This:
| JP2023010012 | PROBER AND CONTROL METHOD THEREFOR |
| JP2003031627 | METHOD OF MEASURING SEMICONDUCTOR CHIP |
| WO/2020/203848 | INSPECTION JIG AND INSPECTION DEVICE |
Inventors:
Kumagai Hokuto
Application Number:
JP2007051704A
Publication Date:
September 19, 2012
Filing Date:
March 01, 2007
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/66; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| JP2007500944A |
Foreign References:
| WO2004097917A1 |
Attorney, Agent or Firm:
Shinji Hayami