Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5029091
Kind Code:
B2
Inventors:
Hiroshi Otsuki
Akira Kuroyanagi
Akira Kuroyanagi
Application Number:
JP2007082703A
Publication Date:
September 19, 2012
Filing Date:
March 27, 2007
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/322; H01L21/02; H01L21/336; H01L21/76; H01L21/762; H01L21/8234; H01L21/8238; H01L27/08; H01L27/088; H01L27/092; H01L27/12; H01L29/786
Domestic Patent References:
| JP6061235A | ||||
| JP2005317719A | ||||
| JP2000315736A | ||||
| JP10189609A |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Taihei Nonobe