Title:
回路接続用フィルム状接着剤
Document Type and Number:
Japanese Patent JP5029691
Kind Code:
B2
Abstract:
A film-like adhesive for circuit connection which is situated between mutually opposing circuit electrodes and, upon heating and pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, characterized in that the water contact angle of the adhesive after curing is 90° or greater.
Inventors:
Kojima Kura
Koji Kobayashi
Yasuhiro Arifu
Koji Kobayashi
Yasuhiro Arifu
Application Number:
JP2009519104A
Publication Date:
September 19, 2012
Filing Date:
June 13, 2007
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/02; C09J9/02; C09J109/00; C09J163/00; C09J171/12; H01R11/01
Domestic Patent References:
| JPH10251610A | 1998-09-22 | |||
| JP2007009176A | 2007-01-18 | |||
| JP2005187637A | 2005-07-14 | |||
| JP2003253231A | 2003-09-10 | |||
| JP2001302998A | 2001-10-31 | |||
| JP2003257247A | 2003-09-12 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu