Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP5030336
Kind Code:
B2
Abstract:
The semiconductor integrated circuit device includes an internal power supply circuit placed between a prescribed one of a plurality of internal circuits and a power supply interconnection for converting a level of an external power supply potential to supply an internal power supply potential to the prescribed internal circuit, and a control circuit for conducting a self-test of the semiconductor integrated circuit device. The control circuit detects a current amount being supplied from the internal power supply circuit to the prescribed internal circuit. The detected result is externally output via a data input/output unit.
Inventors:
Tsukasa Oishi
Application Number:
JP2001172187A
Publication Date:
September 19, 2012
Filing Date:
June 07, 2001
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
G01R31/28; G01R31/30; G01R31/3187; H01L21/822; H01L27/04
Domestic Patent References:
| JP2000111607A | ||||
| JP9101347A |
Attorney, Agent or Firm:
Fukami patent office