Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5033071
Kind Code:
B2
Inventors:
Nobutaka Iwamoto
Application Number:
JP2008164604A
Publication Date:
September 26, 2012
Filing Date:
June 24, 2008
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
LAPIS Semiconductor Miyazaki Co., Ltd.
LAPIS Semiconductor Miyazaki Co., Ltd.
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Domestic Patent References:
| JP200185465A | ||||
| JP200736252A | ||||
| JP2000133775A | ||||
| JP2001177066A | ||||
| JP2005159195A | ||||
| JP200572406A |
Attorney, Agent or Firm:
Motohiko Fujimura
Shigeyuki Nagaoka
Shinji Takano
Shigeyuki Nagaoka
Shinji Takano