Title:
超純粋環境および高腐食環境において使用可能なセンサーとその製造方法
Document Type and Number:
Japanese Patent JP5033421
Kind Code:
B2
Abstract:
The electrical pin lead structure and brazing technique of the present invention provide a brazed lead in a sensor that adheres well to a semiconductor substrate while facilitating lateral flexibility without joint fatigue or breakage. In one example embodiment, the pin lead includes a coil head that is brazed to a silicon layer on a sapphire substrate using a silver-copper-palladium braze material. An advantage to this approach is the ability to both braze the pin lead to the diaphragm and seal the diaphragm to the ceramic backing plate with a high temperature glass in a single process step. Further, the palladium in the braze composition is a factor in reducing surface tension between the metal lead and semiconductor substrate during cooling to avoid stress fractures in the substrate.
Inventors:
Peterson, Tom
Dias Dias, George Andres
Kutch, Gerard Earl.
Dias Dias, George Andres
Kutch, Gerard Earl.
Application Number:
JP2006533058A
Publication Date:
September 26, 2012
Filing Date:
May 14, 2004
Export Citation:
Assignee:
Entegris Incorporated
International Classes:
G01L19/04; G01K7/22; G01L9/00; G01L19/06; H01L29/84
Domestic Patent References:
| JP6060068U | ||||
| JP55085771U | ||||
| JP8178777A | ||||
| JP2002364691A | ||||
| JP5155670A | ||||
| JP62115694U |
Foreign References:
| WO2002008713A1 |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda