Title:
ポジ型フォトレジスト組成物
Document Type and Number:
Japanese Patent JP5035492
Kind Code:
B2
Abstract:
Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, which have so far been difficult to achieve at the same time, at a higher level and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, which have required formation of finer patterns with the increasing packing density in recent years, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R 1 , R 2 , and R 3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5 - p); and s is an integer of 1 to (9 - p).)
Inventors:
Tomoyuki Imada
Takakazu Kage
Norifumi Imaizumi
Takakazu Kage
Norifumi Imaizumi
Application Number:
JP2012519824A
Publication Date:
September 26, 2012
Filing Date:
October 25, 2011
Export Citation:
Assignee:
DIC Corporation
International Classes:
G03F7/023
Domestic Patent References:
| JPH0973169A | 1997-03-18 | |||
| JPH0561195A | 1993-03-12 | |||
| JP2008088197A | 2008-04-17 | |||
| JP2006113136A | 2006-04-27 |
Attorney, Agent or Firm:
Kono Tsuyo