Title:
ポジ型レジスト組成物およびこれを用いたパターン形成方法
Document Type and Number:
Japanese Patent JP5039493
Kind Code:
B2
Abstract:
A positive resist composition includes: (A) a resin containing a repeating unit represented by formula (I) or (I′) as defined in the specification, of which solubility in an alkali developer increases under an action of an acid; and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation: and a pattern forming method uses the positive resist composition.
Inventors:
Hirano Osamu
Shinichi Sugiyama
Shinichi Sugiyama
Application Number:
JP2007256779A
Publication Date:
October 03, 2012
Filing Date:
September 28, 2007
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; G03F7/004; H01L21/027
Domestic Patent References:
| JP2006259509A | ||||
| JP2006301609A | ||||
| JP2002311588A | ||||
| JP2006330099A | ||||
| JP2002023370A | ||||
| JP5094018A |
Attorney, Agent or Firm:
Takeshi Takamatsu
Toshiyuki Ozawa
Kimura Shinya
Toshiyuki Ozawa
Kimura Shinya