Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
材料の成形装置及び材料の成形方法
Document Type and Number:
Japanese Patent JP5045005
Kind Code:
B2
Abstract:

To provide an apparatus and a method for forming a material, by which apparatus and method, the forming accuracy of the formed material can be improved.

The apparatus 10 for forming the material comprises a die 14 on which a workpiece material 12 is arranged, a lid 16 for bringing the workpiece material 12 into close contact with the die 14 by pinching the workpiece material 12 together with the die 14, and a liquid supplying means 18 for supplying the liquid which is introduced from the aperture 30 provided on the lid 16 and forms the workpiece material 12 by pressing it. The die 14 has injection ports 34 for injecting the liquid to the formed workpiece material 12. The aperture 30 provided on the lid 16 and the injection ports 34 provided in the die 14 are connected by a liquid carrying pipe 36. The liquid carrying pipe 36 has a valve 38 for supplying and cutting-off the liquid. When the valve 38 is closed, the workpiece material 12 is formed by being pressed by the liquid. When the valve 38 is opened, the liquid pressed the workpiece material 12 is carried via the liquid carrying pipe 36. When the valve 38 is closed, the workpiece material 12 is separated from the die 14 by spraying the workpiece material with the liquid carried via the liquid carrying pipe 36.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Kimura Maho
Application Number:
JP2006179192A
Publication Date:
October 10, 2012
Filing Date:
June 29, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
B21D26/021; B21D26/025; B21D26/027; B21D26/055
Domestic Patent References:
JP2001129618A
JP61030230A
JP7032071A
JP2006159258A
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida



 
Previous Patent: 反応装置

Next Patent: 両面表示装置