Title:
半導体表示装置の作製方法
Document Type and Number:
Japanese Patent JP5046451
Kind Code:
B2
Inventors:
Hideto Onuma
Application Number:
JP2001288483A
Publication Date:
October 10, 2012
Filing Date:
September 21, 2001
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G02F1/1368; H01L29/786; G09F9/30; H01L21/20; H01L21/336; H01L29/423; H01L29/43; H01L29/49
Domestic Patent References:
| JP2000228527A | ||||
| JP6333948A | ||||
| JP9045930A | ||||
| JP2000091591A | ||||
| JP2000243975A |