Title:
導電性接着剤およびそれを用いた回路
Document Type and Number:
Japanese Patent JP5048031
Kind Code:
B2
Abstract:
To provide an electroconductive adhesive of excellent electrical conductivity, capable of bonding semiconductor elements and chip parts or discrete parts to printed wiring boards without causing any migrations.
The electroconductive adhesive includes electroconductive particles and a resin. In this adhesive, 30 wt.% of more of the electroconductive particles is composed substantially of silver and tin, wherein the molar ratio of metal components of the electroconductive adhesive: silver/tin is (77.5:22.5) to (0:100). A circuit bonded using the electroconductive adhesive is also provided.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
Komagata
Yasuo Shirai
Kenichi Suzuki
Katsuaki Suganuma
Yasuo Shirai
Kenichi Suzuki
Katsuaki Suganuma
Application Number:
JP2009220718A
Publication Date:
October 17, 2012
Filing Date:
September 25, 2009
Export Citation:
Assignee:
Namics Co., Ltd.
Katsuaki Suganuma
Katsuaki Suganuma
International Classes:
C09J201/00; C09J9/02; C09J11/04; H01B1/00; H01B1/22; H01L21/60; H05K3/32
Domestic Patent References:
| JP2000309773A | ||||
| JP2001294844A | ||||
| JP3217476A | ||||
| JP2002265920A | ||||
| JP4401294B2 |
Attorney, Agent or Firm:
Hajime Tsukuni