Title:
多電極サブマージアーク溶接方法
Document Type and Number:
Japanese Patent JP5052997
Kind Code:
B2
Inventors:
Yuu Morimoto
Yuji Hashiba
Shinichi Koichi
Shigeru Ohkita
Yuji Hashiba
Shinichi Koichi
Shigeru Ohkita
Application Number:
JP2007217653A
Publication Date:
October 17, 2012
Filing Date:
August 23, 2007
Export Citation:
Assignee:
Nippon Steel Corporation
International Classes:
B23K9/18; B23K9/23; B23K35/30; B23K35/362; C22C38/00; C22C38/14; C22C38/58; B23K103/04
Domestic Patent References:
| JP11267844A | ||||
| JP2007090399A | ||||
| JP4084676A |
Attorney, Agent or Firm:
Hisataka Tanaka
Shunta Naito
Shunta Naito