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Title:
半導体装置用テープキャリアの製造方法
Document Type and Number:
Japanese Patent JP5057139
Kind Code:
B2
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Inventors:
Hiroyuki Okabe
Hiroaki Hiratsuka
Application Number:
JP2007132397A
Publication Date:
October 24, 2012
Filing Date:
May 18, 2007
Export Citation:
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Assignee:
Hitachi Cable Ltd.
International Classes:
H01L23/12
Domestic Patent References:
JP2002118204A
JP2001148444A
Attorney, Agent or Firm:
Toru Yui



 
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