Title:
微小コンデンサマイクロホンの製造方法
Document Type and Number:
Japanese Patent JP5057572
Kind Code:
B2
Abstract:
In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.
Inventors:
Yoshiyuki Miyashita
Kazumoto Doi
Tadao Imai
Hiroaki Iwanoseki
Kazumoto Doi
Tadao Imai
Hiroaki Iwanoseki
Application Number:
JP2007297687A
Publication Date:
October 24, 2012
Filing Date:
November 16, 2007
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01G7/02; H04R19/01; H04R19/04; H04R31/00
Domestic Patent References:
| JP2007294858A | ||||
| JP2007295308A | ||||
| JP2006033535A | ||||
| JP2009124387A | ||||
| JP2008112755A | ||||
| JP2003047095A | ||||
| JP2003282360A | ||||
| JP11088992A | ||||
| JP2001112091A |
Foreign References:
| WO2006132193A1 | ||||
| WO2005050680A1 |
Attorney, Agent or Firm:
Toyoake Fukui