Title:
超小型電子機器製造において最適な加工ターゲットを定めるための方法
Document Type and Number:
Japanese Patent JP5063846
Kind Code:
B2
Abstract:
A method is provided. for manufacturing, the method including processing a workpiece in a processing step, measuring a parameter characteristic of the processing performed on the workpiece in the processing step, and forming an output signal corresponding to the characteristic parameter measured. The method also includes setting a target value for the processing performed in the processing step based on the output signal.
Inventors:
Toprak, Anthony Jay
Miller, Michael El
Sonderman, Thomas
Miller, Michael El
Sonderman, Thomas
Application Number:
JP2001550802A
Publication Date:
October 31, 2012
Filing Date:
December 04, 2000
Export Citation:
Assignee:
ADVANCED MICRO DEVICES INCORPORATED
International Classes:
H01L21/02; G03F7/20; H01L21/66
Domestic Patent References:
| JP63174331A | ||||
| JP55150221A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Toshio Morita
Yoshihei Nakamura
Yutaka Horii