Title:
ストレスセンサー及びストレスセンサーの組立方法
Document Type and Number:
Japanese Patent JP5091200
Kind Code:
B2
Abstract:
A stress sensor includes a circuit board having a stress sensitive structure, a pointing stick and a metallic back plate. The stress sensitive structure includes a stress deformation region and multiple resistors located on the stress deformation region. The pointing stick is disposed on a top of the circuit board and connected to the stress sensitive structure. The metallic back plate includes at least one fixing material coating region, and thus the fixing edges of the circuit board are fixed on the corresponding fixing material coating region. An assembly method for the stress sensor is also provided.
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Inventors:
Hayashi Shunka
Fumiaki Karasawa
Yellow Shunji
Yellow Poshiro
Fumiaki Karasawa
Yellow Shunji
Yellow Poshiro
Application Number:
JP2009175140A
Publication Date:
December 05, 2012
Filing Date:
July 28, 2009
Export Citation:
Assignee:
Yoshitaka Electronics Co., Ltd.
International Classes:
G01L5/16; G06F3/0338
Domestic Patent References:
| JP2000267803A | ||||
| JP2001075728A | ||||
| JP2003004561A | ||||
| JP3033324U | ||||
| JP8087375A | ||||
| JP2004212047A | ||||
| JP3902134B2 |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito