Title:
ハニカム構造体及びその製造方法
Document Type and Number:
Japanese Patent JP5103377
Kind Code:
B2
Abstract:
Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass% of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass% of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
Inventors:
Nao Masukawa
Atsushi Watanabe
Shuichi Ichikawa
Atsushi Watanabe
Shuichi Ichikawa
Application Number:
JP2008507392A
Publication Date:
December 19, 2012
Filing Date:
February 15, 2007
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
C04B37/00; B01D39/20; B01J35/04; F01N3/021
Domestic Patent References:
| JPH03192176A | 1991-08-22 | |||
| JPH07267746A | 1995-10-17 | |||
| JPH0940476A | 1997-02-10 | |||
| JPS59137374A | 1984-08-07 | |||
| JP2000103687A | 2000-04-11 | |||
| JP2000007455A | 2000-01-11 | |||
| JP2777707B2 | 1998-07-23 |
Attorney, Agent or Firm:
Ippei Watanabe