Title:
施封装置
Document Type and Number:
Japanese Patent JP5104629
Kind Code:
B2
Abstract:
To reduce the size of a sealing device that bundles sheets of paper, such as pieces of paper money, while improving a work efficiency for an operator.
A paper money pressing section 2 sandwiching a paper money bundle P thrown in a throwing position is moved to a sealing position where a paper band catch plate 29 presses a paper band L against the paper money bundle P. The paper money pressing section 2 sandwiching the paper money bundle P is then rotated in a sealing position, and the paper band L is wrapped around the thrown paper money bundle P to be bound.
COPYRIGHT: (C)2010,JPO&INPIT
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Inventors:
Norio Suetaka
Shuichi Takene
Shuichi Takene
Application Number:
JP2008199248A
Publication Date:
December 19, 2012
Filing Date:
August 01, 2008
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
B65B27/08; G07D9/00
Domestic Patent References:
| JP50027694A | ||||
| JP55134016A | ||||
| JP8164916A |
Attorney, Agent or Firm:
Takaji Kanakura