銅表面処理液セット、これを用いた銅の表面処理方法、銅、配線基板および半導体パッケージ

Title:

銅表面処理液セット、これを用いた銅の表面処理方法、銅、配線基板および半導体パッケージ

Document Type and Number:

Japanese Patent JP5109400

Kind Code:

B2

More Like This:

JP5431081	Magnesium-lithium alloy and its surface treatment method
JP7311075	Method for manufacturing electrical steel sheet with pretreatment liquid and insulation coating
JP4793052	High-strength steel sheet with excellent phosphate treatment and its manufacturing method

Inventors:

Tomoaki Yamashita
Fumio Inoue

Application Number:

JP2007039883A

Publication Date:

December 26, 2012

Filing Date:

February 20, 2007

Export Citation:

Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C23C22/78; C23C22/63; C23C22/83; H05K3/38

Domestic Patent References:

Attorney, Agent or Firm:

Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu

Previous Patent: 銅の表面処理方法

Next Patent: 燃料電池及び測定装置