Title:
光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
Document Type and Number:
Japanese Patent JP5132239
Kind Code:
B2
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Inventors:
Koji Noro
Shinya Daejeon
Shinya Daejeon
Application Number:
JP2007262457A
Publication Date:
January 30, 2013
Filing Date:
October 05, 2007
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08L63/00; C08G59/66; C08K5/09; C08K5/37; C08L83/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005089595A | ||||
| JP11335445A | ||||
| JP63186726A | ||||
| JP2007109915A | ||||
| JP2006332262A |
Foreign References:
| WO2006083025A1 | ||||
| US4935454 |
Attorney, Agent or Firm:
Masahiko Nishito
Iisaki Aika
Yuko Saito
Iisaki Aika
Yuko Saito