Title:
熱硬化型オーバーコート樹脂組成物
Document Type and Number:
Japanese Patent JP5134982
Kind Code:
B2
Inventors:
Moon, Bon-Sek
Li, Kwan-Yeon
Kim, sek-kyun
Kim, Jin-Gon
John, Ji Hyun
Cho, Hen-kyu
Byung, Won
Kim sung ho
Li, Kwan-Yeon
Kim, sek-kyun
Kim, Jin-Gon
John, Ji Hyun
Cho, Hen-kyu
Byung, Won
Kim sung ho
Application Number:
JP2008009731A
Publication Date:
January 30, 2013
Filing Date:
January 18, 2008
Export Citation:
Assignee:
SamyangEMS Co.,Ltd.
International Classes:
C09D153/00; C08F212/14; C08F220/32; C08F226/06; C09D133/14; C09D179/04
Domestic Patent References:
| JP2001158816A | ||||
| JP7268155A |
Foreign References:
| WO2005057285A1 |
Attorney, Agent or Firm:
Juichiro Yano