Title:
半導体集積回路チップ検査装置
Document Type and Number:
Japanese Patent JP5139706
Kind Code:
B2
Inventors:
Akihiko Sekine
Hiroki Takeuchi
Hiroki Takeuchi
Application Number:
JP2007087722A
Publication Date:
February 06, 2013
Filing Date:
March 29, 2007
Export Citation:
Assignee:
Topcon Co., Ltd.
International Classes:
H01L21/66; G01N21/956
Domestic Patent References:
| JP3583772B2 |
Attorney, Agent or Firm:
Toru Tanabe