Title:
電解銅箔及び電解銅箔の製造方法
Document Type and Number:
Japanese Patent JP5148726
Kind Code:
B2
Abstract:
The present invention provides an electrolytic copper foil that has a high normal tensile strength, a low decrease in tensile strength after a thermal history, and a low concentration of impurities in the copper foil and a method for producing the copper foil. Specifically, the electrolytic copper foil in which a sulfur concentration of the copper foil is not less than 10 ppm by mass but no more than 50 ppm by mass, wherein when lattices with a spacing of 10 nm in a STEM image observed with a scanning transmission electron microscope at a magnification of 1 million times are formed and intersections of each lattice are used as a measurement point for determining a sulfur concentration, there is a measurement point at which the sulfur concentration is higher as compared to the sulfur concentration of the copper foil.
Inventors:
Tomoki Kobiki
Application Number:
JP2011076638A
Publication Date:
February 20, 2013
Filing Date:
March 30, 2011
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/04; H01M4/66; H01M10/05
Domestic Patent References:
| JP1036992A | ||||
| JP200253993A | ||||
| JP2009221592A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
Previous Patent: JPS5148725
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