Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5155617
Kind Code:
B2
Inventors:
Yasuhiro Takeda
Shiro Kambara
Yoshida Shoji
Takao Kumihashi
Takashi Takeuchi
Hiroshi Yanagita
Hiroshi Ozaki
Kazuharu Yamabe
Maekawa diameter
Shinobu Okani
Shiro Kambara
Yoshida Shoji
Takao Kumihashi
Takashi Takeuchi
Hiroshi Yanagita
Hiroshi Ozaki
Kazuharu Yamabe
Maekawa diameter
Shinobu Okani
Application Number:
JP2007196285A
Publication Date:
March 06, 2013
Filing Date:
July 27, 2007
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/8238; H01L21/28; H01L21/3205; H01L21/768; H01L21/822; H01L23/532; H01L27/04; H01L27/092; H01L29/417
Domestic Patent References:
| JP2006253375A | ||||
| JP9191054A | ||||
| JP2000031293A | ||||
| JP2006287257A | ||||
| JP4267553A |
Attorney, Agent or Firm:
Yamato Tsutsui