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Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5171877
Kind Code:
B2
Inventors:
白石 晶紀
Application Number:
JP2010100866A
Publication Date:
March 27, 2013
Filing Date:
April 26, 2010
Export Citation:
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Assignee:
新光電気工業株式会社
International Classes:
H01L23/12; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
JP2000195861A
JP2003273106A
Attorney, Agent or Firm:
綿貫 隆夫
堀米 和春
岡村 隆志



 
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