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Title:
成膜装置
Document Type and Number:
Japanese Patent JP5176898
Kind Code:
B2
Abstract:

To provide a film-forming device for uniformalizing the shape of a thin film in a whole thin-film-forming area, in case the thin film is formed on a substrate.

The device includes a chamber 210 housing the substrate 9, a first exhaust port 211 fitted to an upper wall face of the chamber 210, a second exhaust port 212 fitted to a lower wall face of the chamber 210 at a position opposed to the first exhaust port 211, a first decompression means connected to the first exhaust port 211 for decompressing and exhausting the inside of the chamber 210, a first regulating valve fitted between the first exhaust port 211 and the first decompression means for regulating exhaust velocity from the first exhaust port 211, a second decompression means connected to the second exhaust port 212 for decompressing and exhausting the inside of the chamber 210, a second regulating valve fitted between the second exhaust port 212 and the second decompression means for regulating exhaust velocity from the second exhaust port 212, and a control part controlling the first regulating valve and the second regulating valve each independently to regulate exhaust velocity each of the first exhaust port 211 and the second exhaust port 212.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Masatsugu Goto
Mari Sakai
Application Number:
JP2008296391A
Publication Date:
April 03, 2013
Filing Date:
November 20, 2008
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H05B33/10; B05C9/12; F26B5/04; F26B21/00; H01L51/50
Domestic Patent References:
JP2000241623A
JP2006153315A
JP2006261027A
JP2007253043A
JP2009086387A
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka



 
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