To provide a method for manufacturing a laminated electronic component such as a laminated ceramic capacitor in which structural defects such as cracks caused in a polishing step are suppressed.
The method for manufacturing a laminated electronic component having an element body in which a ceramic layer and an electrode layer are laminated includes a step of cutting a green laminate in which a green sheet and an electrode pattern are laminated to obtain a green chip including at least a binder resin, a solvent, and a plasticizer, a step of heat-treating the green chip in an inert gas atmosphere, a step of polishing the green chip subjected to the heat treatment, and a step of applying de-bindering and baking to the green chip after polishing to obtain an element body.
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Suzuki Hisaya
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Hitoshi Maeda
Toru Suzuki