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Title:
放熱材料
Document Type and Number:
Japanese Patent JP5180440
Kind Code:
B2
Abstract:

To provide a heat radiation material having excellent heat and moisture resistances, heat conductivity, mechanical strength, low stress properties, electrical insulating properties and molding processability.

The heat radiation material comprises at least a cured product of a bismaleimide represented by general formula (I) (wherein, I represents a maleimide group; Ms represent each a mesogen group; and S represents a spacer). The heat radiation material comprises at least the cured product of a bismaleimide represented by general formula (II). The bismaleimide compound is represented by general formula (II). A resin composition comprises the compound.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Jun Kamada
Mitsunobu Yoshida
Kenichi Goto
Application Number:
JP2006043306A
Publication Date:
April 10, 2013
Filing Date:
February 21, 2006
Export Citation:
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Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L35/00; C07D207/452; C08F22/40; C08K3/00; C08K7/06
Domestic Patent References:
JP2002080617A
JP7082326A
JP7215933A
Other References:
SHINJI TAKEDA,Synthesis and Properties of Bismaleimide Resins Containing Ether Bonds,Journal of Applied Polymer Science,1988年,35 (5),1341-50
Jean Claude Milano,Synthesis, reactivity, and thermalbehavior of bismaleimides and polybismaleimides,Macromolecular Chemistry and Physics,1996年,197(11),3837-3849
Attorney, Agent or Firm:
Koichi Washida
Kazuto Iinuma