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Title:
温度センサ装置
Document Type and Number:
Japanese Patent JP5182140
Kind Code:
B2
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Inventors:
Teruyuki Iida
Isao Kobayashi
Yoshihiko Kato
Application Number:
JP2009036870A
Publication Date:
April 10, 2013
Filing Date:
February 19, 2009
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Assignee:
Mitsubishi Materials Corporation
International Classes:
G01K7/22; G01K1/14
Domestic Patent References:
JP201054270A
JP201066052A
JP10122979A
JP8145023A
JP1123379A
JP2004226325A
Attorney, Agent or Firm:
Hideyuki Sugiura



 
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