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Title:
オフセット同時両側面レーザ衝撃ピーニング
Document Type and Number:
Japanese Patent JP5188657
Kind Code:
B2
Abstract:
An article (108) and method for laser shock peening (LSP) the article (108) to form pairs (88) of longitudinally spaced apart (LD) first and second laser shock peened spots (158, 159) that are on opposite sides of the article (108), simultaneously laser shock peened, and transversely offset (OS) from each other.

Inventors:
ウィ・ウォン・シュー
ジェームズ・ダグラス・リスベック
Application Number:
JP2000297787A
Publication Date:
April 24, 2013
Filing Date:
September 29, 2000
Export Citation:
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Assignee:
ゼネラル・エレクトリック・カンパニイ
International Classes:
C21D7/06; F01D5/28; B23K26/00; B23K26/04; C21D10/00; F04D29/38
Domestic Patent References:
JP11254157A
JP11254156A
JP11509782A
JP10504868A
Attorney, Agent or Firm:
荒川 聡志