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Patent Searching and Data


Title:
電磁気バンドギャップパターン及びその製造方法、並びに電磁気バンドパターンを利用した保安製品
Document Type and Number:
Japanese Patent JP5190088
Kind Code:
B2
Abstract:
Disclosed herein is an electromagnetic bandgap (EBG) pattern structure, including: a nonconductive substrate; and a pattern assembly formed on the substrate and including regularly arranged closed-loop patterns and open-loop patterns both of which are made of a conductive material. The EBG pattern structure is advantageous in that it can be used to manufacture new security products by applying its frequency characteristics to securities or IDs and in that it can be variously used in security technologies for preventing forgery and alteration because various security codes can be created by adjusting the variables of its EBG pattern.

Inventors:
Yanagi
Kei Keirin
Zhang
Shinto Kaoru
Yanagi Jin Hiro
Kim Satomi
Cui Yuan
Application Number:
JP2010115423A
Publication Date:
April 24, 2013
Filing Date:
May 19, 2010
Export Citation:
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Assignee:
Korea Mint
International Classes:
H05K1/02; H01P1/20; H01P1/203; H01P11/00; H01Q15/14; H01Q17/00; H05K3/06; H05K3/10; H05K3/12
Domestic Patent References:
JP2005244043A
JP6244583A
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito