Title:
半導体チップ及び半導体装置
Document Type and Number:
Japanese Patent JP5193840
Kind Code:
B2
Abstract:
A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
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Inventors:
Hikaru Sano
Yoshihiro Tomita
Takahiro Nakano
Yoshihiro Tomita
Takahiro Nakano
Application Number:
JP2008325267A
Publication Date:
May 08, 2013
Filing Date:
December 22, 2008
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/3205; H01L21/768; H01L23/34; H01L23/522; H01L27/14; H01L27/146
Domestic Patent References:
| JP7066384A | ||||
| JP6334197A | ||||
| JP2001044219A | ||||
| JP2004228273A | ||||
| JP2008288309A |
Attorney, Agent or Firm:
Maeda patent office
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura