Title:
ウエハキャリア、化学蒸着装置、および、ウエハを処理する方法
Document Type and Number:
Japanese Patent JP5200171
Kind Code:
B2
Abstract:
In chemical vapor deposition apparatus, a wafer carrier (32) has a top surface (34) holding the wafers and a bottom surface (36) heated by radiant heat transfer from a heating element (28). The bottom surface (36) of the wafer carrier is non-planar due to features such as depressions (54) so that the wafer carrier has different thickness at different locations. The thicker portions of the wafer carrier have higher thermal resistance. Differences in thermal resistance at different locations counteract undesired non-uniformities in heat transfer to the wafer. The wafer carrier may have pockets with projections (553, 853) for engaging spaced-apart locations on the edges of the wafer.
Inventors:
Wolf, Boris
Soderman, blade
Armor, Eric A.
Soderman, blade
Armor, Eric A.
Application Number:
JP2011525016A
Publication Date:
May 15, 2013
Filing Date:
August 28, 2009
Export Citation:
Assignee:
Beco Instruments Incorporated
International Classes:
H01L21/205; C23C16/458
Domestic Patent References:
| JP2004327761A | ||||
| JP5275355A | ||||
| JP10060674A | ||||
| JP4123265U | ||||
| JP5335253A | ||||
| JP10087394A | ||||
| JP7074114A |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura
Fukagawa Eri
Satoshi Morimoto
Kyoko Tsunoda
Hirose Miki
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura
Fukagawa Eri
Satoshi Morimoto
Kyoko Tsunoda
Hirose Miki