Title:
多層プリント配線基板
Document Type and Number:
Japanese Patent JP5201206
Kind Code:
B2
Abstract:
A multilayer printed circuit board, including: a signal interconnection which transmits and receives an electrical signal between electronic components; a ground interconnection connected to a ground of a circuit; a power interconnection connected to a power layer to supply power to electronic components; at least one ground layer installed in an inner layer; at least one clearance which passes through the ground layer; and a ground via which connects the ground interconnection with the ground layer. The signal interconnection and the ground interconnection or the signal interconnection and the power interconnection are installed in a pair, and a pair of interconnection vias for interlayer connection are inserted through the clearance installed in the ground layer so that one of the pair of interconnection vias is connected to the ground layer by the ground interconnection.
Inventors:
Takashi Yoshinaga
Kenji Kataoka
Otsuki Dojin
Kenji Kataoka
Otsuki Dojin
Application Number:
JP2010505662A
Publication Date:
June 05, 2013
Filing Date:
March 24, 2009
Export Citation:
Assignee:
NEC
International Classes:
H05K3/46; H05K1/02
Domestic Patent References:
| JP2007250645A | 2007-09-27 | |||
| JP2003163467A | 2003-06-06 | |||
| JP2007165483A | 2007-06-28 | |||
| JP2003031945A | 2003-01-31 | |||
| JP2005064028A | 2005-03-10 | |||
| JP2001060770A | 2001-03-06 |
Attorney, Agent or Firm:
Sumio Tanai
Ryuichiro Mori
Naoki Matsuo
Ryuichiro Mori
Naoki Matsuo