Title:
有機EL素子封止用光硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP5201347
Kind Code:
B2
Abstract:
A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.
Inventors:
Yoshihide Arai
Hiromasa Kitazawa
Kenichi Horie
Hiromasa Kitazawa
Kenichi Horie
Application Number:
JP2008305666A
Publication Date:
June 05, 2013
Filing Date:
November 28, 2008
Export Citation:
Assignee:
ThreeBond Co., Ltd.
International Classes:
C08G59/68; C08G59/20; H01L51/50; H05B33/04
Domestic Patent References:
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| JP2007112956A | ||||
| JP2006179318A | ||||
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