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Title:
部品把持装置とその方法
Document Type and Number:
Japanese Patent JP5203010
Kind Code:
B2
Abstract:

To provide a component grasping device and a method therefor, controlling the angle and position of a component while grasping the component, swiftly controlling the grasping force and promptly performing the work from component recognition to component installation when adopted to a component mounting device.

The component grasping device includes a grasping means 150 for grasping a component 102 and a control means 180 for controlling the grasping means 150. The grasping means 150 is provided with three or more grasping claws 172, 174, 176 for grasping the component 102 and driving sources 154, 156, 158 being independent of one another and driving the grasping claws 172, 174, 176. The control means 180 is installed with a disturbance observer 200 for controlling the grasping means 150 and a torsional reaction force estimation observer 202. The grasping means 150 is subjected to resonance ratio control by a control command from the control means 180 to the driving sources 154, 156, 158.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Masaru Saito
Akihiko Nakamura
Application Number:
JP2008087662A
Publication Date:
June 05, 2013
Filing Date:
March 28, 2008
Export Citation:
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Assignee:
JUKI Corporation
International Classes:
B25J15/08; H05K13/04
Domestic Patent References:
JP6155358A
JP2007043884A
JP8137503A
JP2008048539A
JP7112385A
JP2008030167A
JP2003280703A
JP2002361588A
Attorney, Agent or Firm:
Satoshi Takaya
Keisuke Matsuyama
Tsuyoshi Makino



 
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