Title:
めっきピラーパッケージの形成
Document Type and Number:
Japanese Patent JP5204789
Kind Code:
B2
Abstract:
A method involves plating pillars of electrically conductive material up from a seed layer located on a substrate, surrounding the pillars with a fill material so that the pillars and fill material collectively define a first package, and removing the substrate from the first package.
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Inventors:
John Trezza
Application Number:
JP2009549725A
Publication Date:
June 05, 2013
Filing Date:
February 14, 2008
Export Citation:
Assignee:
CUFER ASSET LTD. L.L.C.
International Classes:
C25D1/00; H01L23/12
Domestic Patent References:
| JP2006108236A | ||||
| JP2002004077A | ||||
| JP2001129800A | ||||
| JP2002260753A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki
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