Title:
成膜処理用治具及びプラズマCVD装置
Document Type and Number:
Japanese Patent JP5209954
Kind Code:
B2
Abstract:
A film-forming method of an osmium film includes disposing a metal plate in a chamber; introducing OsO4 gas at a flow rate of 0.1 to 3 cc/min and an inert gas for maintaining discharge into the chamber while maintaining the pressure in the chamber to 13 to 40 Pa; and forming an osmium film on the surface of the metal plate by turning the gas in the chamber into plasma using radio frequency output power with the density of 0.25 to 2.0 W/cm2.
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Inventors:
White Sat Takeshi
Yuji Honda
Hiroshi Sato
Masamichi Osawa
Yuji Honda
Hiroshi Sato
Masamichi Osawa
Application Number:
JP2007329867A
Publication Date:
June 12, 2013
Filing Date:
December 21, 2007
Export Citation:
Assignee:
U-Tech Co., Ltd.
Daiwa Techno Systems Co., Ltd.
Daiwa Techno Systems Co., Ltd.
International Classes:
C23C16/50; H01L21/285
Domestic Patent References:
| JP8209352A | ||||
| JP6028992A | ||||
| JP6009223A | ||||
| JP2002060941A | ||||
| JP2006092765A | ||||
| JP6016386B2 |
Attorney, Agent or Firm:
Mutsumi Yanase
Atsushi Watanabe
Atsushi Watanabe