Title:
電子部品加工方法、及び電子部品実装方法
Document Type and Number:
Japanese Patent JP5214483
Kind Code:
B2
Inventors:
Eiji Moriyama
Eiji Tanaka
Hirofumi Matsuura
Eiji Tanaka
Hirofumi Matsuura
Application Number:
JP2009025545A
Publication Date:
June 19, 2013
Filing Date:
February 06, 2009
Export Citation:
Assignee:
Ricoh Microelectronics Co., Ltd.
International Classes:
H01L23/36; H05K7/20
Domestic Patent References:
| JP200938049A | ||||
| JP2008218561A | ||||
| JP3254393A |
Attorney, Agent or Firm:
Toshi Kuroda