Title:
はんだバンプの形成方法
Document Type and Number:
Japanese Patent JP5218837
Kind Code:
B2
Abstract:
To provide a method of forming a solder bump more easily without causing missing bumps on a substrate.
In the method of forming an Sn or Sn-based solder alloy film 2 of 1.0 to 5.0 μm in thickness on a Cu pad 5 in an aperture of solder resist 6 formed on the substrate, and forming the solder bump 4 on the Sn or Sn-based solder alloy film 2 using solder paste for bump formation, the Sn or Sn-based solder alloy film 2 is formed by applying Sn or Sn-based solder alloy paste containing 20 to 35 mass% of low thixo-agent flux containing a 0.1 to <1 mass% thixo agent and the balance Sn or Sn-based solder alloy powder of 0.5 to 3.0 μm in average particle diameter, and then performing reflow processing.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
Masayuki Ishikawa
Akihiro Masuda
Nakagawa
Akihiro Masuda
Nakagawa
Application Number:
JP2008277645A
Publication Date:
June 26, 2013
Filing Date:
October 29, 2008
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H05K3/34; H01L21/60
Domestic Patent References:
| JP2004119441A | ||||
| JP2004207534A | ||||
| JP2007075882A | ||||
| JP6122090A |
Attorney, Agent or Firm:
Kazuo Tomita
Kageyama Shuichi
Kageyama Shuichi