Title:
接合用把持ジグ、接合装置及び接合体の製造方法
Document Type and Number:
Japanese Patent JP5232004
Kind Code:
B2
Abstract:
A gripping jig 20 for assembling applies a fixing force with a slider 30 to a molded body 50 in a direction perpendicular to an assembling direction, and when an assembling load or more is applied to the molded body 50, the fixing force is adjustable with an adjustment screw 24 such that the molded body 50 is guided with a through-hole 27 to move in the assembling direction. Since the fixing force is applied from a direction different from the assembling direction in such a manner, the molded body 50 can move in the assembling direction, and as the fixing force is adjustable with the adjustment screw 24, the application of the assembling load to the molded body 50 and the movement of the molded body 50 can be adjusted. Since a plurality of the molded bodies 50 are fixed and assembled respectively, when there are variations in size of the molded bodies 50, if a load over the assembling load is applied, each molded body 50 is guided by a movement unit to move, so that more uniform assembling load can be applied to the plurality of the entire molded bodies 50.
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Inventors:
Kunihiko Yoshioka
Matsumoto Manaki
Koji Kimura
Shinya Yoshida
Takashi Ota
Matsumoto Manaki
Koji Kimura
Shinya Yoshida
Takashi Ota
Application Number:
JP2008538671A
Publication Date:
July 10, 2013
Filing Date:
October 03, 2007
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B28B11/00; C04B37/00; H01J9/24
Domestic Patent References:
| JP2000302489A | 2000-10-31 | |||
| JP2003165779A | 2003-06-10 |
Foreign References:
| WO1999062103A1 | 1999-12-02 |
Attorney, Agent or Firm:
Aitec International Patent Office