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Title:
半導体装置
Document Type and Number:
Japanese Patent JP5246130
Kind Code:
B2
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Inventors:
Satoshi Oshima
Application Number:
JP2009239479A
Publication Date:
July 24, 2013
Filing Date:
October 16, 2009
Export Citation:
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Assignee:
富士通株式会社
International Classes:
H01L23/373; H01L23/40
Domestic Patent References:
JP1076743A
JP2004281676A
JP8255921A
JP2007258435A
Attorney, Agent or Firm:
Shuhei Katayama



 
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