芳香族ポリイミド組成物及びそれから製造される物品

Japanese Patent JP5249580

B2

This invention relates to an aromatic polyimide molding composition, comprising at least one aromatic polyimide (A) and typically from 0.5 to 30 % wt of at least one fluoroelastomer (B), with respect to the total weight of (A) and (B), to a method for manufacturing the same, to a molding process of the same, and to the articles manufactured therefrom.Preferably, the component (A) of the composition is at least one aromatic polyamide-imide manufactured by a process including the polycondensation reaction between (i) at least one acid monomer chosen from trimellitic anhydride and trimellitic anhydride monoacid halides and (ii) at least one comonomer chosen from the group consisting of 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylether, m-phenylenediamine and mixtures therefromAdvantageously, the aromatic polyimide composition of the invention, owed to its improved flexibility during the molding process, is suitable for the manufacture of articles from mold of complex geometries, such as undercuts, without permanently deforming or cracking upon ejection from the mold.

JP2015127424	POLYAMIDEIMIDE RESIN, INSULATING COATING MATERIAL, INSULATING COATING AND INSULATING WIRE USING THE SAME
JPH10316754	PHOTOSENSITIVE HEAT-RESISTANT RESIN AND VARNISH

Wakoski Gregory
Sildo Philip
Empina do Romano
Stern Bryan A

JP2007523044A

July 31, 2013

April 26, 2005

Click for automatic bibliography generation  

Solvay (Societe Anonym)

C08G73/14; C08L79/08; C08K3/00; C08L27/12; C09D179/08; C08L27/16

JP5271537A
JP2001323174A
JP6128440A
JP5027153A
JP2132156A
JP60038464A
JP6331040A
JP2003165970A

WO2003010237A1

Sadao Kumakura
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama

Previous Patent: JPS5249579

Next Patent: MEDICAL SILVER HALIDE PHOTOGRAPHIC SENSITIVE MATERIAL AND ITS TREATMENT