Title:
芳香族ポリイミド組成物及びそれから製造される物品
Document Type and Number:
Japanese Patent JP5249580
Kind Code:
B2
Abstract:
This invention relates to an aromatic polyimide molding composition, comprising at least one aromatic polyimide (A) and typically from 0.5 to 30 % wt of at least one fluoroelastomer (B), with respect to the total weight of (A) and (B), to a method for manufacturing the same, to a molding process of the same, and to the articles manufactured therefrom.Preferably, the component (A) of the composition is at least one aromatic polyamide-imide manufactured by a process including the polycondensation reaction between (i) at least one acid monomer chosen from trimellitic anhydride and trimellitic anhydride monoacid halides and (ii) at least one comonomer chosen from the group consisting of 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylether, m-phenylenediamine and mixtures therefromAdvantageously, the aromatic polyimide composition of the invention, owed to its improved flexibility during the molding process, is suitable for the manufacture of articles from mold of complex geometries, such as undercuts, without permanently deforming or cracking upon ejection from the mold.
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Inventors:
Wakoski Gregory
Sildo Philip
Empina do Romano
Stern Bryan A
Sildo Philip
Empina do Romano
Stern Bryan A
Application Number:
JP2007523044A
Publication Date:
July 31, 2013
Filing Date:
April 26, 2005
Export Citation:
Assignee:
Solvay (Societe Anonym)
International Classes:
C08G73/14; C08L79/08; C08K3/00; C08L27/12; C09D179/08; C08L27/16
Domestic Patent References:
JP5271537A | ||||
JP2001323174A | ||||
JP6128440A | ||||
JP5027153A | ||||
JP2132156A | ||||
JP60038464A | ||||
JP6331040A | ||||
JP2003165970A |
Foreign References:
WO2003010237A1 |
Attorney, Agent or Firm:
Sadao Kumakura
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama
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