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Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP5257015
Kind Code:
B2
Abstract:
In a semiconductor integrated circuit device including a digital circuit region in which a digital circuit is formed, and an analog circuit region in which an analog circuit is formed, the analog circuit region is separated into an active element region in which an active element of the analog circuit is formed, and a resistive and capacitive element region in which a resistor or a capacitor of the analog circuit is formed, the resistive and capacitive element region is arranged in a region adjacent to the digital circuit region, and the active element region is arranged in a region separated from the digital circuit region.

Inventors:
Takatoshi Itagaki
Application Number:
JP2008295743A
Publication Date:
August 07, 2013
Filing Date:
November 19, 2008
Export Citation:
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Assignee:
MITSUMI ELECTRIC CO.,LTD.
International Classes:
H01L21/822; H01L21/82; H01L27/04
Domestic Patent References:
JP1220467A
JP7235616A
JP2007251139A
Attorney, Agent or Firm:
Tadahiko Ito



 
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