Title:
誘電性ビルドアップ層のレーザ支援エッチングを用いて、パターン化された埋込み導電層を提供する方法
Document Type and Number:
Japanese Patent JP5261484
Kind Code:
B2
Abstract:
A method of providing a patterned conductive layer. The method includes: providing a build-up layer comprising an insulating material; laser irradiating selected portions of the build-up layer according to a predetermined pattern of the patterned conductive layer to be provided, laser irradiating comprising using a laser beam having a photon energy higher than a bonding energy of at least some of the chemical bonds of the insulating material to yield predetermined laser-weakened portions of the build-up layer according to the predetermined pattern; removing the laser-weakened portions of the build-up layer to yield recesses according to the predetermined pattern; and filling the recesses with a conductive material to yield the patterned conductive layer.
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Inventors:
Lee, Young Gang
Application Number:
JP2010515065A
Publication Date:
August 14, 2013
Filing Date:
June 25, 2008
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H05K3/10; H05K3/00
Domestic Patent References:
JP2001144410A | ||||
JP8047790A |
Foreign References:
WO2005034595A1 | ||||
WO2005092559A1 | ||||
US5173442 |
Attorney, Agent or Firm:
Masanori Honjo
Yoshiko Honjo
Yoshiko Honjo
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