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Title:
改良された2面式プロセス流体圧力測定システム
Document Type and Number:
Japanese Patent JP5265683
Kind Code:
B2
Abstract:
A pressure measurement system includes a co-planar pressure sensor module coupled to a bi-planar pressure flange. The co-planar pressure sensor module has a pair of isolator diaphragms that are substantially co-planar with one another. A plurality of connection rings are welded proximate and about respective isolator diaphragms. A bi-planar pressure flange is welded to each of the connection rings. Fluidic coupling from a process fluid pressure inlet of the bi-planar flange to an isolator diaphragm of the co-planar pressure module occurs without encountering any compressive seals. A method of manufacturing a pressure measurement system is also provided.

Inventors:
Sandet, Paul, Sea.
Noberg, Daniel, A.
Dill, Andrew, A.
Application Number:
JP2010524901A
Publication Date:
August 14, 2013
Filing Date:
July 30, 2008
Export Citation:
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Assignee:
Rosemount Incorporated
International Classes:
G01L13/02
Domestic Patent References:
JP2002513148A
JP2000065667A
JP2005037310A
JP2128935U
Attorney, Agent or Firm:
Kaori Tanaka
Kiyotaka Sakamoto
Sanji Tanabe



 
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