Title:
構造体の端部を検査するためのプローブ
Document Type and Number:
Japanese Patent JP5271923
Kind Code:
B2
Abstract:
An apparatus including a linear array transducer coupled to an upper housing of the apparatus and positioned above a tapered chamber. The tapered chamber configured to maintain a column of couplant between the linear array transducer and a structure to be inspected as the linear array transducer is positioned over an edge of the structure.
Inventors:
Young, Fred, Dee.
Application Number:
JP2009551827A
Publication Date:
August 21, 2013
Filing Date:
February 27, 2008
Export Citation:
Assignee:
The Boeing Company
International Classes:
G01N29/28
Domestic Patent References:
| JP7113795A | ||||
| JP2006064698A | ||||
| JP6502914A | ||||
| JP4018358U | ||||
| JP9325133A | ||||
| JP63263467A |
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Kobayashi Yoshinori