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Patent Searching and Data


Title:
半導体装置の製造方法及び半導体装置
Document Type and Number:
Japanese Patent JP5275056
Kind Code:
B2
Inventors:
Masamichi Suzuki
Hirotake Nishino
Tatsuo Shimizu
Miyata Masayasu
Kosuke Tatsumura
Yoshifumi Nishi
Kinoshita Atsuhiro
Application Number:
JP2009011185A
Publication Date:
August 28, 2013
Filing Date:
January 21, 2009
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
H01L21/8238; H01L21/336; H01L27/092; H01L29/423; H01L29/49; H01L29/78; H01L29/786
Domestic Patent References:
JP2009141161A
JP2003068993A
JP2006128416A
JP2005085822A
JP2006093670A
JP2006084409A
JP2008537359A
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen