Title:
低分子量のポリアミノポリアミド-エピクロロヒドリン(PAE)樹脂およびタンパク質の接着剤組成物
Document Type and Number:
Japanese Patent JP5275991
Kind Code:
B2
Abstract:
The invention is directed to compositions containing polyamidoamine-epihalohydrin resins (PAE resins) of low molecular weight and a soy protein or lignin in which the weight ratio of protein or lignin to PAE is 100:0.1 to 0.1:100. The invention is also directed to the use of the compositions as adhesives for binding wood materials. The lower adhesive viscosity provides better handling properties, as well as allowing for less water in the adhesive formulation. The lower viscosity provides for both ease of handling of the adhesive material and the pot life if the adhesive formulation
Inventors:
Sprawl, brian kay
Brady, Richard Elle
Allen, Anthony Jay
Brady, Richard Elle
Allen, Anthony Jay
Application Number:
JP2009525634A
Publication Date:
August 28, 2013
Filing Date:
August 23, 2007
Export Citation:
Assignee:
HERCULES INCORPORATED
International Classes:
C08L77/06; C08L89/00; C08L97/00; C09J163/00; C09J189/00; C09J197/00
Domestic Patent References:
| JP2002201267A |
Foreign References:
| WO2005072260A1 | ||||
| WO2004092248A1 |
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Hiroaki Noya
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Hiroaki Noya